Methods for drying wafer

Details Methods for drying wafer Methods for drying wafer

2005-01-18

2005-01-18

El-Arini, Zeinab (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001300, C134S002000, C134S010000, C134S018000, C134S019000, C134S026000, C134S033000, C134S06400P, C134S068000, C134S12200P, C134S148000, C134S153000, C134S184000, C134S902000

Reexamination Certificate

active

06843855

ABSTRACT:
Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

REFERENCES:
patent: 6007675 (1999-12-01), Toshima
patent: 6641678 (2003-11-01), DeYoung et al.
Bok, E., et al., “Supercritical Fluids For Single Wafer Cleaning,” Solid State Technology, Technology Topics, Jun. 1992, pp. 117-120.

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