Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-15
2008-07-15
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S012000, C438S023000, C438S026000, C438S027000, C438S028000, C438S030000, C438S031000, C438S034000, C438S036000, C438S037000, C438S038000, C438S039000, C438S040000, C257S704000, C257S706000, C257S707000, C257S790000, C257S791000, C257S792000, C257S793000, C257S794000, C257S795000, C257S796000, C206S710000, C206S711000, C206S712000, C206S713000, C206S714000, C206S715000, C206S716000, C206S717000, C206S832000
Reexamination Certificate
active
07399657
ABSTRACT:
Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires. Solder balls are provided for electrical connection or the substrate and the die to a circuit board or other circuit element, and an encapsulant layer covers the surface of the substrate but permits electrical connection to the bond pads. Methods for packaging semiconductor die in such packages are also provided.
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Bolken Todd O.
Cobbley Chad A.
Jr. Carl Whitehead
Micro)n Technology, Inc.
Mitchell James M
Perkins Coie LLP
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