4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Chad A. Cobbley

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Adhesive composition and methods for use in packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive composition for use in packaging applications

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
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Apparatus and method of stacking die on a substrate

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Apparatus and methods of automated wafer-grinding using...

Abrading – Precision device or process - or with condition responsive... – With indicating
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Apparatus for attaching solder balls to BGA package...

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
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Profile ID: LFUS-PAI-P-2073253

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