4. Plastic and nonmetallic article shaping or treating: processes
  5. Mechanical shaping or molding to form or reform shaped article
  6. To produce composite, plural part or multilayered article

Todd O. Bolken

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Alternative method used to package multimedia card by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Apparatus for encapsulating a multi-chip substrate array

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Apparatus for encapsulating a multi-chip substrate array

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Apparatus for reduced flash encapsulation of microelectronic...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate

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Asymmetric transfer molding method and an asymmetric encapsulati

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent

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Profile ID: LFUS-PAI-P-577533

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