Semiconductor assemblies and methods of manufacturing such...

Details Semiconductor assemblies and methods of manufacturing such... Semiconductor assemblies and methods of manufacturing such...

2011-03-29

2011-03-29

Brewster, William M. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S793000

Reexamination Certificate

active

07915711

ABSTRACT:
Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of manufacturing a semiconductor device includes forming a plurality of first side trenches to an intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes removing material from a second side of the molded portion at areas aligned with the first side trenches, wherein removing the material forms openings through the molded portion. The method further includes forming a plurality of electrical contacts at the second side of the molded portion at the openings and electrically connecting the second side contacts to corresponding bond-sites on the dies.

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