Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2011-04-12
2011-04-12
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S113000, C438S106000, C257SE21214, C257SE21237, C257SE21238, C257SE21483, C257SE21499
Reexamination Certificate
active
07923349
ABSTRACT:
An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5538758 (1996-07-01), Beach et al.
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 5691248 (1997-11-01), Cronin et al.
patent: 5716759 (1998-02-01), Badehi
patent: 5870351 (1999-02-01), Ladabaum et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6255726 (2001-07-01), Vindasius et al.
patent: 6297657 (2001-10-01), Thiessen et al.
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6338980 (2002-01-01), Satoh
patent: 6351030 (2002-02-01), Havens et al.
patent: 6582992 (2003-06-01), Poo et al.
patent: 6624505 (2003-09-01), Badehi
patent: 6667543 (2003-12-01), Chow et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6706971 (2004-03-01), Albert et al.
patent: 6722213 (2004-04-01), Offen et al.
patent: 6777767 (2004-08-01), Badehi
patent: 6844623 (2005-01-01), Peterson et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 6910268 (2005-06-01), Miller
patent: 6940022 (2005-09-01), Vinciarelli et al.
patent: 6956283 (2005-10-01), Peterson
patent: 6964915 (2005-11-01), Farnworth et al.
patent: 6972480 (2005-12-01), Zilber et al.
patent: 6973718 (2005-12-01), Sheppard, Jr. et al.
patent: 7029949 (2006-04-01), Farnworth et al.
patent: 7215018 (2007-05-01), Vindasius et al.
patent: 7221051 (2007-05-01), Ono et al.
patent: 7259455 (2007-08-01), Seto
patent: 7279363 (2007-10-01), Cherukuri et al.
patent: 2001/0012725 (2001-08-01), Maeda et al.
patent: 2001/0031548 (2001-10-01), Elenius et al.
patent: 2002/0168798 (2002-11-01), Glenn et al.
patent: 2003/0099085 (2003-05-01), Duva
patent: 2003/0122243 (2003-07-01), Lee et al.
patent: 2003/0209772 (2003-11-01), Prabhu
patent: 2004/0113283 (2004-06-01), Farnworth et al.
patent: 2004/0217446 (2004-11-01), Headley et al.
patent: 2004/0251520 (2004-12-01), Sasaki et al.
patent: 2005/0082651 (2005-04-01), Farnworth et al.
patent: 2005/0085050 (2005-04-01), Draney et al.
patent: 2005/0148160 (2005-07-01), Farnworth et al.
patent: 2006/0068567 (2006-03-01), Beyne et al.
patent: 2006/0076690 (2006-04-01), Khandros et al.
patent: 2006/0278971 (2006-12-01), Barnes et al.
patent: 2008/0303131 (2008-12-01), McElrea et al.
patent: 2008/0315407 (2008-12-01), Andrews et al.
International Search Report for PCT Application No. PCT/US2008/067541, mailed Oct. 27, 2008.
International Preliminary Report on Patentability, PCT Application US2008/067541, mailed Jan. 7, 2010.
Office Action mailed Dec. 22, 2006, U.S. Appl. No. 11/016,558.
Amendment filed Jun. 21, 2007 in repsonse to Office Action mailed Dec. 22, 2006, U.S. Appl. No. 11/016,558.
Final Office Action mailed Jul. 19, 2007, U.S. Appl. No. 11/016,558.
Amendment filed Sep. 19, 2007 in response to Final Office Action mailed Jul. 19, 2007, U.S. Appl. No. 11/016,558.
Amendment filed Jan. 22, 2008 in response to Final Office Action mailed Jul. 19, 2007, U.S. Appl. No. 11/016,558.
Office Action mailed Mar. 27, 2008, U.S. Application No. 11/016,558.
Amendement filed Jun. 27, 2008 in response to Office Action mailed Mar. 27, 2008, U.S. Application No. 11/016,558.
Final Office Action mailed Sep. 15, 2008, U.S. Application No. 11/016,558.
Amendment filed Oct. 14, 2008 in response to Final Office Action mailed Sep. 15, 2008, U.S. Application No. 11/016,558.
Office Action mailed Dec. 15, 2008, U.S. Appl. No. 11/016,558.
Amendment filed Apr. 8, 2009 in response to Office Action mailed Dec. 15, 2008, U.S. Appl. No. 11/016,558.
Office Action mailed Jul. 15, 2009, U.S. Application No. 11/016,558.
Amendment filed Aug. 5, 2009 Office Action mailed Jul. 15, 2009, U.S. Appl. No. 11/016,558.
Notice of Allowance mailed Dec. 17, 2009, U.S. Appl. No. 11/016,558.
Office Action mailed Jan. 27, 2009 U.S. Appl. No. 11/849,162.
Amendment filed Mar. 27, 2009 in response to Office Action mailed Jan. 27, 2009 U.S. Appl. No. 11/849,162.
Office Action mailed Jun. 24, 2009 (restriction) U.S. Appl. No. 11/849,162.
Amendment filed Jul. 8, 2009 in response to Office Action mailed Jun. 24, 2009 (restriction) U.S. Appl. No. 11/849,162.
Office Action mailed Oct. 7, 2009 (restriction) U.S. Appl. No. 11/849,162.
Amendment filed Nov. 9, 2009 in response to Office Action mailed Oct. 7, 2009 (restriction) U.S. Appl. No. 11/849,162.
International Search Report for PCT Appl No. US2009/047389, mailed Jan. 14, 2010.
International Search Report for PCT Application No. PCT/US2008/065793, mailed Dec. 22, 2008.
International Search Report for PCT Application No. PCT/US2008/065788, mailed Sep. 30, 2008.
International Search Report for PCT Application No. PCT/US2008/067722, mailed Feb. 25, 2009.
International Search Report for PCT Application No. PCT/US2008/079948, mailed Mar. 17, 2009.
International Search Report mailed Mar. 23, 2009, International Application No. PCT/US2008/74450.
Office Action mailed Jul. 21, 2010 U.S. Appl. No. 11/849,162.
Andrews, Jr. Lawrence Douglas
Caskey Terrence
Co Reynaldo
Crane Scott Jay
Du Yong
Haynes Beffel & Wolfeld LLP
Kennedy Bill
Nhu David
Vertical Circuits, Inc.
LandOfFree
Wafer level surface passivation of stackable integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer level surface passivation of stackable integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level surface passivation of stackable integrated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2729537