4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing

Lawrence Douglas Andrews, Jr.

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Flat leadless packages and stacked leadless package assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Wafer level surface passivation of stackable integrated...

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2331228

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