4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing

Vertical Circuits, Inc.

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Flat leadless packages and stacked leadless package assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Micropede stacked die component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Semiconductor die separation method

Semiconductor device manufacturing: process – Semiconductor substrate dicing
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Silicon segment programming apparatus and three terminal...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Stacked die BGA or LGA component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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