Source/drain strained layers

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – With lattice constant mismatch

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S018000, C257S629000, C257S369000, C257S408000, C257SE29193

Reexamination Certificate

active

07973337

ABSTRACT:
A semiconductor device and method of manufacture thereof wherein a PMOS source/drain region of a transistor within the substrate includes a first strained layer in the PMOS source/drain region and a first capping layer in contact with the first strained layer. Further, the semiconductor device and method provide for an NMOS source/drain region of a transistor within the substrate including a second strained layer in the NMOS source/drain region and a second capping layer in contact with the second strained layer.

REFERENCES:
patent: 4728619 (1988-03-01), Pfiester et al.
patent: 5006477 (1991-04-01), Farb
patent: 6051458 (2000-04-01), Liang et al.
patent: 6649538 (2003-11-01), Cheng et al.
patent: 6703271 (2004-03-01), Yeo et al.
patent: 6806151 (2004-10-01), Wasshuber et al.
patent: 6921913 (2005-07-01), Yeo et al.
patent: 7118952 (2006-10-01), Chen et al.
patent: 7166528 (2007-01-01), Kim et al.
patent: 7202142 (2007-04-01), Lee et al.
patent: 2002/0190344 (2002-12-01), Michejda et al.
patent: 2004/0087075 (2004-05-01), Wang et al.
patent: 2004/0115878 (2004-06-01), Lee et al.
patent: 2004/0157399 (2004-08-01), Lee et al.
patent: 2005/0035409 (2005-02-01), Ko et al.
patent: 2005/0093021 (2005-05-01), Ouyang et al.
patent: 2006/0186470 (2006-08-01), Chen et al.
patent: 2006/0189053 (2006-08-01), Wang et al.
patent: 2006/0267106 (2006-11-01), Chao et al.
patent: 2007/0057287 (2007-03-01), Lin et al.
patent: 2007/0132038 (2007-06-01), Chong et al.
patent: 2007/0138570 (2007-06-01), Chong et al.
patent: 2008/0102571 (2008-05-01), Pan
patent: 2008/0277734 (2008-11-01), Bhattacharyya et al.
patent: 2009/0075029 (2009-03-01), Thomas et al.
patent: 1761072 (2006-04-01), None
patent: 2005-72056 (2005-03-01), None
Bedell, S.W., et al., “300 mm SGOI/Strained-Si High-Performance CMOS,” 2004 Semiconductor Equipment and Materials International, Semicon West, (2004) 6 pages.
Chidambaram, P.R., et al., “35% Drive Current Improvement from Recessed-SiGe Drain Extensions on 37 nm Gate Length PMOS,” 2004 Symposium on VLSI Technology Digest of Technical Papers (2004) pp. 48-49.
Ghani, T., “A 90nm High Volume Manufacturing Logic Technology Featuring Novel 45 nm Gate Length Strained Silicon CMOS Transistors,” IEDM (2003) pp. 978-980.
Lee, B.H., et al., “Performance Enhancement on Sub-70nm Strained Silicon SOI MOSFETs on Ultra-thin Thermally Mixed Strained Silicon/SiGe on Insulator (TM-SGOI) Subsrate with Raised S/D,” IEDM (2002) pp. 946-948.
Mizuno, T., et al., “High-Performance Strained-SOI CMOS Devices Using Thin Film SiGe-on-Insulator Technology,” IEEE Transactions on Electron Devices, vol. 50, No. 4 (Apr. 2003) pp. 988-994.
Shimizu, A., et al., “Local Mechanical-Stress COntrol (LMC): A New Technique for CMOS-Performance Enhancement,” International Electron Devices Meeting (2001) pp. 433-436.
Tezuka, T., et al., “A Novel Fabrication Technique of Ultrathin and Relaxed SiGe Buffer Layers with High Ge Fraction for Sub-100 nm Strained Silicon-on-Insulator MOSFETs,” Jpn. J. Appl. Phys., vol. 40 (Apr. 2001) pp. 2866-2874.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Source/drain strained layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Source/drain strained layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Source/drain strained layers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2628029

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.