Tape carrier and assembly structure thereof

Details Tape carrier and assembly structure thereof Tape carrier and assembly structure thereof

1996-10-11

1998-10-20

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257667, 257669, 361813, 361820, H01L 23495

Patent

active

058250816

ABSTRACT:
The present invention is characterized by providing leads not contributing to actual connection outside the corner leads to prevent the deformation of the corner leads and improve the yield of tape carriers. A device hole is made in a near-central place of an insulating resin film. Around the device hole, outer-lead holes are made. On the insulating resin film, a plurality of wiring patterns are provided and forced to project into the device hole. The plurality of wiring patterns are formed into a plurality of inner leads, of which the outermost ones are determined to be corner leads. On each corner of the device hole, an aligning mark is provided. Dummy leads are provided closer to the aligning marks. The dummy leads are made shorter than the inner leads and corner leads.

REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4400714 (1983-08-01), Brown
patent: 5220196 (1993-06-01), Michii et al.
patent: 5250842 (1993-10-01), Ikeda
patent: 5424577 (1995-06-01), Suzuki et al.
patent: 5541447 (1996-07-01), Maejima et al.
patent: 5554885 (1996-09-01), Yamasaki et al.
patent: 5637914 (1997-06-01), Tanaka et al.

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