Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
Examiner
active
No affiliations
3-D integrated circuit assembly employing discrete chips
Adhesive composition, semiconductor device using the composition
Air manifold for cooling electronic devices
Aluminum nitride substrate for formation of thin-film conductor
Anchor provisions to prevent mold delamination in an overmolded
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Profile ID: LFUS-PAI-P-28192