Semiconductor package

Details Semiconductor package Semiconductor package

1998-08-03

2000-06-06

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

257735, 257723, H01L 27108, H01L 2976, H01L 2994, H01L 31119

Patent

active

060722118

ABSTRACT:
A semiconductor package (10) forms an impedance matching capacitor by utilizing an insulator (12), a conductor (19) on the dielectric, and a substrate (11) as elements of the capacitor. The capacitor is electrically connected, as part of an impedance matching network to shunt the inductance of the bonding wires (21) that connect the semiconductor die (18) an input lead (17).

REFERENCES:
patent: 3617817 (1971-11-01), Kawakatsu
patent: 3784884 (1974-01-01), Zoroglu
patent: 3801938 (1974-04-01), Goshgarian
patent: 4617586 (1986-10-01), Cuvilliers
patent: 4953001 (1990-08-01), Kaiser et al.
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5103283 (1992-04-01), Hite
patent: 5371405 (1994-12-01), Kagawa
patent: 5477085 (1995-12-01), Kose
patent: 5602421 (1997-02-01), Li
patent: 5767564 (1998-06-01), Kunimatsu et al.
Ted Johansson, "Inside the RF Power Transistor," RF Power Transistors Data Book, pp. 85-90, Jun. 1997.

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