Process for resist pattern formation using positive electrodepos

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430325, 430330, 4302701, 4302871, 4302881, 430919, 430921, G03F 7027

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active

057028729

ABSTRACT:
A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.

REFERENCES:
patent: 5364738 (1994-11-01), Kondo et al.
patent: 5384229 (1995-01-01), Pai et al.
Moon et al., Chem. Mater. 1993, vol. 5, No. 9, pp. 1315 -1320.

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