Method for producing high speed integrated circuits

Details Method for producing high speed integrated circuits Method for producing high speed integrated circuits

1992-05-11

1993-06-01

Picard, Leo P.

Metal working

Method of mechanical manufacture

Electrical device making

29855, 174 522, 257664, 257668, 257728, H05K 330, H01L 2328

Patent

active

052148459

ABSTRACT:
This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits are stacked in multilayers and are connected to respective lead fingers and respective die circuits by standard, known methods such as TAB or wire bond and encapsulated in a known way. The ground plane and power plane being adjacent to the signal plane reduces the power-ground loop inductance and thus reduces the package noise. By reducing the inductance, the circuit can have a shorter switching time. Also, by adding the ground plane, the power-ground capacitance is increased, which serves to reduce the effect of power supply fluctuations in the system.

REFERENCES:
patent: 4989066 (1991-01-01), Sumi
patent: 4989117 (1991-01-01), Hernandez
patent: 5053852 (1991-10-01), Biswas et al.

Affiliated with

Also associated with

Rating

Method for producing high speed integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing high speed integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing high speed integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1806473