4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Jerrold L. King

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Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-435135

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