4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Walter L. Moden

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Adhesion enhanced semiconductor die for mold compound packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Walter L. Moden does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Walter L. Moden, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Walter L. Moden will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-57250

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure