Dynamic feedback electrostatic wafer chuck

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361235, 279128, H02N 1300

Patent

active

058123610

ABSTRACT:
An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.

REFERENCES:
patent: 3993509 (1976-11-01), McGinty
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4431473 (1984-02-01), Okano et al.
patent: 4464223 (1984-08-01), Gorin
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4645218 (1987-02-01), Ooshio et al.
patent: 4665463 (1987-05-01), Ward et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 4724510 (1988-02-01), Wicker et al.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4897171 (1990-01-01), Ohmi
patent: 4962441 (1990-10-01), Collins
patent: 4983254 (1991-01-01), Fujimura et al.
patent: 5055964 (1991-10-01), Logan et al.
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5104834 (1992-04-01), Watanabe et al.
patent: 5110438 (1992-05-01), Ohmi et al.
patent: 5117121 (1992-05-01), Watanabe et al.
patent: 5151845 (1992-09-01), Watanabe et al.
patent: 5160152 (1992-11-01), Toraguchi et al.
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5191506 (1993-03-01), Logan et al.
patent: 5325261 (1994-06-01), Horwitz
patent: 5326725 (1994-07-01), Sherstinsky et al.
patent: 5350479 (1994-09-01), Collins et al.
patent: 5459632 (1995-10-01), Birang et al.
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5467249 (1995-11-01), Barnes et al.
patent: 5535507 (1996-07-01), Barnes et al.
patent: 5557215 (1996-09-01), Saeki et al.
patent: 5561585 (1996-10-01), Barnes et al.
patent: 5587045 (1996-12-01), Keller et al.
patent: 5665166 (1997-09-01), Deguchi et al.
Daviel, J.F., et al., Electrostatic Clamping Applied to Semiconductor Plasma Processing, I. Theoretical Modeling, Nov. 1993, J. Electrochem. Soc., No. 11.
Wright, D.R., et al., Manufacturing issues of eletrostatic chucks, Jul./Aug. 1995, J. Vac. Sci. Technol. B.
Daviel, J.F., et al., Electrostatic Clamping Applied to Semiconductor Plasma Processing, II. Experimental Results, J. Electrochem, Soc., vol. 140, No. 11, Nov. 1993.
Watanabe, Toshiya, et al., Relationship between Electrical Resistivity and Electrostatic Force and Alumina Electrostatic Chuck, Feb. 1993, Jpn. J. Appl. Phys. vol. 32, pp. 864-871, Part 1, No. 2.
Watanabe, T., et al., Electrostatic charge distribution in the dielectric layer of alumina electrostatic chuck, 1994, Journal of Materials Science 29, pp. 3510-3516.
Field, John, Wafer Handling, Electrostatic wafer clamping for next-generation manufacturing, Sep., 1994, Solid State Technology.
Unknown, "Patent Abstracts of Japan", vol. 095, No. 002, & JP 06 326176A, Tokyo Electron, Ltd., Nov. 25, 1994 (Publication Date).
Unknown, "Patent Abstracts of Japan", vol. 18, No. 599 (E-1631), & JP 06 232089A, Tokyo Electron, Ltd., Aug. 19, 1994 (Publication Date).
Yunju Ra and Ching-Hwa Chen, "Direct current bias as an ion current monitor in the transformer coupled plasma etcher", vol. 11, No. 6, Nov. 1, 1993, pp. 2911-2913, Journal of Vacuum Science and Technology, Woodbury, NY.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dynamic feedback electrostatic wafer chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dynamic feedback electrostatic wafer chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dynamic feedback electrostatic wafer chuck will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1628715

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.