Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-03-14
2006-03-14
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S591000, C438S722000, C438S738000
Reexamination Certificate
active
07012027
ABSTRACT:
A method is described for selectively etching a high k dielectric layer that is preferably a hafnium or zirconium oxide, silicate, nitride, or oxynitride with a selectivity of greater than 2:1 relative to silicon oxide, polysilicon, or silicon. The plasma etch chemistry is comprised of one or more halogen containing gases such as CF4, CHF3, CH2F2, CH3F, C4F8, C4F6, C5F6, BCl3, Br2, HF, HCl, HBr, HI, and NF3and leaves no etch residues. An inert gas or an inert gas and oxidant gas may be added to the halogen containing gas. In one embodiment, a high k gate dielectric layer is removed on portions of an active area in a MOS transistor. Alternatively, the high k dielectric layer is used in a capacitor between two conducting layers and is selectively removed from portions of an ILD layer.
REFERENCES:
patent: 6297539 (2001-10-01), Ma et al.
patent: 6300202 (2001-10-01), Hobbs et al.
patent: 6306715 (2001-10-01), Chan et al.
patent: 6432779 (2002-08-01), Hobbs et al.
patent: 2003/0211748 (2003-11-01), Jin et al.
patent: 2004/0038554 (2004-02-01), Ahn et al.
patent: 200275972 (2002-03-01), None
Chiu Yuan-Hung
Hsu Peng-Fu
Perng Baw-Ching
Sung Mei-Hui
Haynes and Boone LLP
Jr. Carl Whitehead
Pham Thanhha
Taiwan Semiconductor Manufacturing Company , Ltd.
LandOfFree
Zirconium oxide and hafnium oxide etching using halogen... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Zirconium oxide and hafnium oxide etching using halogen..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Zirconium oxide and hafnium oxide etching using halogen... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3564797