4. Cleaning and liquid contact with solids
  5. Processes
  6. For metallic, siliceous, or calcareous basework, including...

Mei-Hui Sung

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Dual damascene structure employing laminated intermediate...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method for forming a dual damascene aperture while employing...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
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Method of resist stripping over low-k dielectric material

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
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Multi-purpose composite mask for dual damascene patterning

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Protecting method applied to the semiconductor manufacturing...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Profile ID: LFUS-PAI-P-1736783

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