4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Chan Peng Yeen

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Die attach method and leadframe structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Die attach method and microarray leadframe structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadless leadframe package design that provides a greater...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2458227

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