4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Hasfiza Ramley

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Method of fabricating a micro-array integrated circuit package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Wire bonding on thinned portions of a lead-frame configured...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3067607

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