Wafer-level flip-chip assembly methods

Details Wafer-level flip-chip assembly methods Wafer-level flip-chip assembly methods

2011-07-12

2011-07-12

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S108000

Reexamination Certificate

active

07977155

ABSTRACT:
A method of packaging integrated circuit structures is provided. The method includes providing a wafer having bonding conductors on a surface of the wafer, and applying a compound underfill onto the surface of the wafer. The compound underfill includes an underfill material and a flux material. A die is then bonded on the wafer after the step of applying the compound underfill, wherein solder bumps on the die are joined with the bonding conductors.

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