Wafer boat and film formation method

Details Wafer boat and film formation method Wafer boat and film formation method

1997-12-16

2000-12-05

Nelms, David

Coating apparatus

Work holders, or handling devices

118723, 219390, 219400, 211 4114, 211 4118, B05C 1300

Patent

active

061561215

ABSTRACT:
A wafer boat that supports a plurality of semiconductor wafers at a predetermined pitch, which are to be processed by a vertical thermal processing furnace, comprises a plurality of support columns; wafer support grooves formed in the support columns for supporting the peripheral edges of the wafers; and a film thickness equalization plate that is substantially the same size as the wafers. or is larger than the wafers, and is provided in wafer support grooves that are adjacent to one another in the vertical direction. This configuration ensures the same type of film is formed on the surface facing the surface of the wafer, achieving uniformity of the thus-formed film thickness.

REFERENCES:
patent: 5109264 (1992-04-01), Ohdate
patent: 5217340 (1993-06-01), Harada et al.
patent: 5622639 (1997-04-01), Kitayama et al.
patent: 5662469 (1997-09-01), Okase et al.
patent: 5752609 (1998-05-01), Kato et al.

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