Vertical offset structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Reexamination Certificate

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Details

C257S433000, C257SE29324, C438S459000, C385S018000

Reexamination Certificate

active

11183863

ABSTRACT:
A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.

REFERENCES:
patent: 6391673 (2002-05-01), Ha et al.
patent: 6694504 (2004-02-01), Cho et al.
patent: 6739189 (2004-05-01), Lee et al.
patent: 6841839 (2005-01-01), Sridhar et al.
patent: 6939473 (2005-09-01), Nasiri et al.
patent: 7034370 (2006-04-01), Kuo
patent: 2002/0158293 (2002-10-01), Lee et al.
patent: 2002/0164833 (2002-11-01), Cho et al.
patent: 2005/0170656 (2005-08-01), Nasiri et al.
patent: 2005/0266598 (2005-12-01), Kim et al.

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