Variable high temperature chuck for high density plasma chemical

Details Variable high temperature chuck for high density plasma chemical Variable high temperature chuck for high density plasma chemical

1996-09-30

1998-11-10

Fleming, Fritz

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

058353348

ABSTRACT:
An electrostatic chuck comprises an electrode cap with a dielectric layer for attracting and holding the back side of a semiconductor wafer positioned on the top surface of the dielectric layer, and a lower electrode. The electrostatic chuck is heated by resistive heating elements attached to or embedded within the chuck. The electrostatic chuck is cooled by circulating liquid coolant through the body of the chuck. Coolant gas is provided at the back side of the semiconductor wafer to improve thermal transfer. A feedback control mechanism maintains the chuck, and consequently the wafer, at a predetermined temperature by actively controlling both the heating and the cooling functions.

REFERENCES:
patent: 4384918 (1983-05-01), Abe
patent: 4771730 (1988-09-01), Tezuka
patent: 4980566 (1990-12-01), Heilweil
patent: 5055964 (1991-10-01), Logan et al.
patent: 5078851 (1992-01-01), Nishihata et al.
patent: 5111032 (1992-05-01), Batliwalla et al.
patent: 5134436 (1992-07-01), Fujioka
patent: 5155652 (1992-10-01), Logan et al.
patent: 5166856 (1992-11-01), Liporace et al.
patent: 5221403 (1993-06-01), Nozawa et al.
patent: 5280156 (1994-01-01), Nori et al.
patent: 5290381 (1994-03-01), Nozawa et al.
patent: 5376213 (1994-12-01), Ueda et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5413360 (1995-05-01), Atari et al.
patent: 5436790 (1995-07-01), Blake et al.
patent: 5567267 (1996-10-01), Kazama et al.
patent: 5581874 (1996-12-01), Aoki et al.
patent: 5584971 (1996-12-01), Komino
patent: 5591269 (1997-01-01), Arami et al.
patent: 5609720 (1997-03-01), Lenz et al.
patent: 5616024 (1997-04-01), Nobori et al.
patent: 5625526 (1997-04-01), Watanabe et al.
patent: 5660740 (1997-08-01), Komino
patent: 5665166 (1997-09-01), Deguchi et al.
GPI Web Client Abstract of Japan JP405175160A, Misuaki et al., Jul. 13, 1993.
Patent Abstract of Japan; vol. 018, No. 102 (E-1511), dated 18 Feb. 1994 & JP 05304116 A (Hitachi Ltd), 16 Nov. 1993.
Patent Abstract of Japan; vol. 096, No. 003, 29 Mar. 196 & JP 07 302785 A (Fujitsu Ltd.), 14 Nov. 1995.

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