Vapor deposition apparatus and vapor deposition method

Details Vapor deposition apparatus and vapor deposition method Vapor deposition apparatus and vapor deposition method

1997-12-16

2000-10-17

Lorin, Francis J.

Coating apparatus

Gas or vapor deposition

Work support

C23C 1600

Patent

active

061325198

ABSTRACT:
A vapor deposition apparatus for supplying raw-material gas into a reactor to form a thin film on a wafer substrate disposed in the reactor by vapor deposition, including at least a rotator for mounting the wafer substrate thereon, a treatment gas introducing port, a straightening vane having plural holes, and a wafer substrate feed-in/out port, wherein the lowermost portion of the wafer feed-in/out port is located at a predetermined height from the upper surface of the rotator, and the difference in height between the lowermost portion of the wafer feed-in/out port and the upper surface of the rotator is set to be larger than the thickness of a transition layer of the upper portion of the rotator. In a vapor deposition method, a wafer substrate is mounted on the rotator to form a thin film having little defect and uniform film thickness on the wafer substrate by using the vapor deposition apparatus.

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