Use of a faceted etch process to eliminate stringers

Details Use of a faceted etch process to eliminate stringers Use of a faceted etch process to eliminate stringers

1993-04-20

1994-09-13

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 156657, 437228, H01L 2100

Patent

active

053465857

ABSTRACT:
A process to create a faceted (prograde) profile for an integrated circuit, in which the top corners of a layer disposed over a feature are preferentially etched, thereby creating slopes. The profile which results from the deposit of subsequent layers is more easily etched as a result of the contour imparted by the faceted edges. Since the subsequent layers are placed in the "line of sight" of the etch plasma, there are significantly fewer "stringers."

REFERENCES:
patent: 5203957 (1993-04-01), Yoo et al.

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