Ultrasonic wire bonding apparatus and method

Details Ultrasonic wire bonding apparatus and method Ultrasonic wire bonding apparatus and method

1995-02-02

1997-09-16

Bradley, P. Austin

Metal fusion bonding

Process

Using high frequency vibratory energy

228 11, B23K 2010

Patent

active

056671300

ABSTRACT:
An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.

REFERENCES:
patent: 4893742 (1990-01-01), Bullock
patent: 5377894 (1995-01-01), Mizoguchi et al.
patent: 5385288 (1995-01-01), Kyomasu et al.

Affiliated with

Also associated with

Rating

Ultrasonic wire bonding apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic wire bonding apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic wire bonding apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-212674