4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Makoto Imanishi

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Apparatus and method for forming bump

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Apparatus and method for forming bump

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Apparatus for mounting an electronic component

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Reexamination Certificate

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Bump bonder with a discard bonding area

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Bump bonding apparatus and method

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-386527

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