4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Takahiro Yonezawa

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Apparatus for mounting electronic component on substrate

Boots – shoes – and leggings
Patent

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Bare chip mounting method and bare chip mounting system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Bonding apparatus and bonding method

Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate

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Bonding method and apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Reexamination Certificate

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Bump bonder with a discard bonding area

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-386528

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