Process for selective transfer of a microstructure formed on an

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156230, 156249, B32B 3100

Patent

active

061593230

ABSTRACT:
Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:

REFERENCES:
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patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5508065 (1996-04-01), Weiner
patent: 5897727 (1999-04-01), Staral et al.
patent: 5915167 (1999-06-01), Leedy
Alignable Epitaxial Liftoff of GaAs Materials with Selective Deposition Using Polyimide Diaphragms, C. Camperi-Ginested, M. Hargis, N. Jokerst, and M. Allen, IEEE Transactions Photonics Technology Letters, vol. 3, No. 12, Dec., 1991.

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