Two-step STI formation process

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S294000, C438S295000, C438S355000, C257SE21545, C257SE21561, C257SE21564, C257SE21628, C257SE21540, C257SE21642, C257S347000, C257SE27112, C257S374000, C257S510000

Reexamination Certificate

active

07842577

ABSTRACT:
A method of forming an integrated circuit structure includes providing a semiconductor substrate; forming a first isolation region in the semiconductor substrate; after the step of forming the first isolation region, forming a metal-oxide-semiconductor (MOS) device at a surface of the semiconductor substrate, wherein the step of forming the MOS device comprises forming a source/drain region; and after the step of forming the MOS device, forming a second isolation region in the semiconductor substrate.

REFERENCES:
patent: 5874328 (1999-02-01), Liu et al.
patent: 6927114 (2005-08-01), Park
patent: 7230270 (2007-06-01), Chen et al.
patent: 2002/0113288 (2002-08-01), Clevenger et al.
patent: 2004/0171197 (2004-09-01), Park
patent: 2006/0086987 (2006-04-01), Chen et al.
patent: 2006/0108644 (2006-05-01), Chen et al.
patent: 1525552 (2004-09-01), None
patent: 1797762 (2006-07-01), None

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