Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – With means applying electromagnetic wave energy or...
Reexamination Certificate
2007-01-09
2007-01-09
Mayekar, Kishor (Department: 1753)
Chemical apparatus and process disinfecting, deodorizing, preser
Chemical reactor
With means applying electromagnetic wave energy or...
Reexamination Certificate
active
10342121
ABSTRACT:
A substrate processing apparatus has a process chamber and an effluent treatment reactor. The process chamber has a substrate support, a process gas supply, a gas energizer, and an exhaust conduit. The effluent treatment reactor has an effluent inlet to receive effluent from the exhaust conduit of the process chamber, a plasma cell having one or more electrodes electrically connected to a voltage source adapted to electrically bias the electrodes to couple energy to effluent received in the plasma cell, a scrubbing cell coaxially exterior to the plasma cell, the scrubbing cell having a scrubbing fluid inlet to introduce scrubbing fluid into effluent in the scrubbing cell and a scrubbing fluid outlet, and an effluent outlet to release the treated effluent.
REFERENCES:
patent: 3218781 (1965-11-01), Allemann et al.
patent: 5827407 (1998-10-01), Wang et al.
patent: 6309610 (2001-10-01), Nejezchleb et al.
patent: 2003/0012718 (2003-01-01), Josephson et al.
patent: 215706 (1984-11-01), None
patent: 4319118 (1994-12-01), None
patent: 19526737 (1997-01-01), None
patent: 0885648 (1993-12-01), None
patent: 0820801 (1998-01-01), None
patent: 0916388 (1999-05-01), None
patent: 1224964 (2002-07-01), None
patent: 51129868 (1976-11-01), None
patent: 58045718 (1983-03-01), None
patent: 4110013 (1990-08-01), None
patent: 4247218 (1991-01-01), None
patent: 5125928 (1991-10-01), None
patent: 5261242 (1992-03-01), None
patent: 7197806 (1993-12-01), None
patent: 10192653 (1998-07-01), None
patent: 2227117 (1999-02-01), None
patent: 2001087621 (1999-09-01), None
patent: WO-8800088 (1988-01-01), None
patent: WO99/61132 (1999-02-01), None
patent: WO99/26726 (1999-06-01), None
patent: WO-01032297 (2001-05-01), None
“ASTRON™—Atomic Fluorine Generator” website located at www.astex.com.
Two view graphs (Astron) which were used in a presentation at Applied Materials, Inc. on Mar. 10, 1999.
“ESCAPE”—DAS, www.das.tz-dd.de/English/products/products.html.
“LITMAS”—Litmas Blue, Foreline Abatement Systems & Litmas Red, Atmospheric Pressure Plasma System—www.litmas.com/products/html.
“CENTROTHERM”—Atmospheric Plasma Scrubber, www.centrotherm.de/products/environmental/environmental.htm.
“EDWARDS”—GP-Wet Scrubbers, www.edwards.boc.com/exhaust—manage/gp-wet.html.
Evans et al., “Plasma remediation of trichloroethylene in silent discharge plasmas,” J. Appl. Phys. 74:9 pp. 5378-5387 (1993).
Flippo et al., Abatement of Fluorine Emissions Utilizing an ATMI CDO™ Model 863 with Steam Injection (2001).
Grothaus et al., “Harmful Compounds Yield to Nonthermal Plasma Reactor,” SWRI Technology Today, www.swri.rg, pp. 1-9 (published in Technology Today, Spring 1996).
International Sematech Disclosure, “Evaluation of a Litmas ‘Blue’ Point-of-Use (POU) Plasma Abatement Device for Perfluorocompound (PFC) Destruction,” Technology Transfer No. 98123605A-Eng (Dec. 15, 1998).
Lester, “Clean Processing. No More PFC Emissions in Plasma Chamber Cleaning?” Semiconductor, p. 46 (2000).
Rosenthal et al., “Corona Discharge for Surface Treatment,” IEEE Trans. Ind. Appln., 1-5, pp. 328-335 (1975).
Timms et al., “The chemistry of volatile waste from silicon wafer processing,” J. Chem. Soc., pp. 815-822 (1999).
Vartanian et al., “Plasma Abatement Reduces PFC Emission,” Semiconductor International, pp. 191-198 (2000).
PCT International Search Report for International Application No. PCT/US02/22055, mailed Oct. 21, 2002.
Aardahl Christopher L.
Orth Rick J.
Porshnev Peter
Raoux Sebastien
Rappe Kenneth G.
Applied Materials Inc.
Janah Ashok K.
Mayekar Kishor
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