Transistor devices and methods of making

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S288000, C438S719000, C257SE21409, C257SE29255

Reexamination Certificate

active

08084329

ABSTRACT:
In an embodiment, a method of fabricating a transistor device comprises: providing a semiconductor topography comprising a gate conductor disposed above a semiconductor substrate between a pair of dielectric spacers; anisotropically etching exposed regions of the semiconductor substrate on opposite sides of the dielectric spacers to form recessed regions in the substrate; oxidizing exposed surfaces of the substrate in the recessed regions to form an oxide thereon; removing the oxide from bottoms of the recessed regions while retaining the oxide upon sidewalls of the recessed regions; and isotropically etching the substrate such that the recessed regions undercut the pair of dielectric spacers.

REFERENCES:
patent: 7303949 (2007-12-01), Chen et al.
patent: 7323391 (2008-01-01), Arghavani
patent: 7838372 (2010-11-01), Han et al.
patent: 2007/0200170 (2007-08-01), Yamasaki et al.
patent: 2007/0267703 (2007-11-01), Chong et al.
patent: 2008/0048217 (2008-02-01), Kim et al.
patent: 2008/0128746 (2008-06-01), Wang
patent: 2008/0277699 (2008-11-01), Chakravarthi et al.
patent: 2009/0140351 (2009-06-01), Lin et al.
patent: 2010/0187578 (2010-07-01), Faltermeier et al.
patent: 2010/0237431 (2010-09-01), Feudel et al.

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