Transistor and process of making a transistor having an improved

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438303, 438305, 438624, 438780, H01L 21336

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active

060543566

ABSTRACT:
A transistor is provided with a gradually increasing source and drain arsenic doping profile in a lateral direction from the gate conductor sidewall surfaces. The very smooth doping profile ensures small electric fields at the channel-drain interface for the benefit of reducing hot-carrier effects. Such a doping profile may be achieved by performing the ion implantation through a non-conformal layer of spin-on glass. By controlling the viscosity of the SOG and its deposition speed, different meniscus shapes may be formed. The doping profile of the arsenic in the source and drain regions follows the profile of the upper surface of the SOG. Arsenic is advantageously used for both the lightly doped and heavily doped regions of the source/drain junctions. Arsenic has lower mobility compared to phosphorus and is better at maintaining its original doping profile in heating of the device during further processing. Too much alteration in the original doping profile over time may change the device characteristics beyond acceptable levels.

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