Transfer molding of integrated circuit packages

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06988882

ABSTRACT:
A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting the first and second cavities. The first cavity is adapted to enclose the integrated circuit chip on the substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.

REFERENCES:
patent: 5077237 (1991-12-01), Hara
patent: 5700723 (1997-12-01), Barber
patent: 5817545 (1998-10-01), Wang et al.
patent: 5834340 (1998-11-01), Sawai et al.
patent: 5981312 (1999-11-01), Farquhar et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6011694 (2000-01-01), Hirakawa
patent: 6046076 (2000-04-01), Mitchell et al.
patent: 6081997 (2000-07-01), Chia et al.
patent: 6117382 (2000-09-01), Thummel
patent: 6177724 (2001-01-01), Sawai
patent: 6306688 (2001-10-01), Lunceford
patent: 6338985 (2002-01-01), Greenwood
patent: 6413801 (2002-07-01), Lin
patent: 6432751 (2002-08-01), Haji
patent: 6455349 (2002-09-01), Brand
patent: 6498054 (2002-12-01), Chiu et al.
patent: 6534345 (2003-03-01), Muff et al.
patent: 1 075 022 (2001-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Transfer molding of integrated circuit packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transfer molding of integrated circuit packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer molding of integrated circuit packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3592599

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.