4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Marie-France Boyaud

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Transfer molding of integrated circuit packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Transfer molding of integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Transfer molding of integrated circuit packages

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2673252

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