Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
Inventor
active
Transfer molding of integrated circuit packages
Transfer molding of integrated circuit packages
Transfer molding of integrated circuit packages
No associations
LandOfFree
Marie-Claude Paquet does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Marie-Claude Paquet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Marie-Claude Paquet will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2673254