4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Real Tetreault

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Alignment systems for subassemblies of overmolded...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Assembly of opto-electronic module with improved heat sink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Assembly of opto-electronic module with improved heat sink

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Integrated circuit chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Transfer molding method for forming integrated circuit package

Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Flash or sprue removal type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-526369

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