Three dimensional semiconductor memory device and method of...

Details Three dimensional semiconductor memory device and method of... Three dimensional semiconductor memory device and method of...

2011-07-05

2011-07-05

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S694000, C438S740000, C257SE23145, C257SE21677

Reexamination Certificate

active

07972955

ABSTRACT:
Provided are a three dimensional semiconductor memory device and a method of fabricating the same. The method includes forming a stepwise structure by using mask patterns and a sacrificial mask pattern formed on the mask patterns as a consumable etch mask.

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Tanaka et al., “Bit Cost Scalable Technology with Punch and Plug Process for Ultra High Density Flash Memory”, 2007 Symposium on VLSI Technology Digest of Technical Papers, pp. 14-15.

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