Thinner composition for washing a photoresist in a process for p

Details Thinner composition for washing a photoresist in a process for p Thinner composition for washing a photoresist in a process for p

1996-12-20

1999-02-02

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Finishing or perfecting composition or product

430311, G03C 500

Patent

active

058663053

ABSTRACT:
A thinner composition used in a washing process for manufacturing semiconductor devices includes at least ethyl lactate (EL) and ethyl-3-ethoxy propionate (EEP), and preferably, additionally includes Gamma-butyrolactone. The thinner composition has high volatility and low viscosity as well as a sufficient solubility rate for rinsing photoresist on the wafer when spraying the thinner through nozzles. Photoresist at the edge or backside of a wafer can be effectively removed at a sufficiently rapid rate, so that the yield of the semiconductor devices is enhanced. In addition, any remaining photoresist attached to the surface can be completely removed to enable the reuse of the wafer, with resulting economic benefits.

REFERENCES:
patent: 4965167 (1990-10-01), Salamy
patent: 5362608 (1994-11-01), Flaim et al.
patent: 5426017 (1995-06-01), Johnson
DeForest, W.S., Photoresist Materials and Processes, McGraw-Hill, NY, 1975, pp. 222-224.

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