Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
Attorney
active
No affiliations
Array capacitors for broadband decoupling applications
Article having metal impregnated within carbon nanotube array
Ball-limiting metallurgies, solder bump compositions used...
Capillary-flow underfill compositions, packages containing...
Coated thermal interface in integrated circuit die
LandOfFree
John N. Greaves does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with John N. Greaves, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and John N. Greaves will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2194554