4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Cheng-Yi Liu

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Apparatus and method for removing background on visual

Image analysis – Image segmentation
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Flip chip interconnection structure and process of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Light emitting diode and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure
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Light emitting diode structure

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
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Method for aligning gesture features of image

Image analysis – Pattern recognition
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Profile ID: LFUS-PAI-P-2678287

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