Thin solid electrolytic capacitor embeddable in a substrate

Details Thin solid electrolytic capacitor embeddable in a substrate Thin solid electrolytic capacitor embeddable in a substrate

2008-02-14

2010-06-29

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S171000, C438S210000, C438S238000, C438S239000, C257SE27024, C257SE51003, C257SE51025

Reexamination Certificate

active

07745281

ABSTRACT:
An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

REFERENCES:
patent: 6765784 (2004-07-01), Ohya et al.
patent: 7126811 (2006-10-01), Hirano et al.
patent: 7215534 (2007-05-01), Saito et al.
patent: 2006/0120014 (2006-06-01), Nakamura et al.
patent: 2007/0159771 (2007-07-01), Saito et al.
patent: 2007123855 (2007-05-01), None

Affiliated with

Also associated with

Rating

Thin solid electrolytic capacitor embeddable in a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin solid electrolytic capacitor embeddable in a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin solid electrolytic capacitor embeddable in a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4221691