Thermally enhanced wafer level package

Details Thermally enhanced wafer level package Thermally enhanced wafer level package

2010-07-01

2011-10-18

Dang, Trung Q (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C257SE21499

Reexamination Certificate

active

08039315

ABSTRACT:
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.

REFERENCES:
patent: 6605525 (2003-08-01), Lu et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 6940177 (2005-09-01), Dent et al.
patent: 7019406 (2006-03-01), Huang et al.
patent: 7091062 (2006-08-01), Geyer
patent: 7476980 (2009-01-01), Rebibis et al.
patent: 2004/0214373 (2004-10-01), Jiang et al.
patent: 2005/0212129 (2005-09-01), Huang et al.
patent: 2007/0134846 (2007-06-01), Takahashi et al.
patent: 2007/0298603 (2007-12-01), Rebibis et al.
patent: 101101900 (2009-01-01), None

Affiliated with

Also associated with

Rating

Thermally enhanced wafer level package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced wafer level package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced wafer level package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4298726