4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Hsin-Hui Lee

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Apparatus and method for manufacturing a semiconductor wafer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Apparatus and method for manufacturing a semiconductor wafer...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Application of impressed-current cathodic protection to...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Application of impressed-current cathodic protection to...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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DFR laminating and film removing system

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2208988

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