Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-04-11
2006-04-11
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S704000, C257S713000, C257S778000, C257S780000, C257S723000
Reexamination Certificate
active
07026711
ABSTRACT:
A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a plurality of electrically conductive members coupled to corresponding ones of the plurality of microelectronics device and extending away from the first surface. A thermally conductive layer is located on the second surface of the device substrate, and a package substrate is coupled to the device substrate, the package substrate having a plurality of electrically conductive traces coupled to corresponding ones of the plurality of electrically conductive members.
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Huang Chender
Lee Chien-Hsiun
Lee Daniel
Haynes and Boone LLP
Parekh Nitin
Taiwan Semiconductor Manufacturing Company , Ltd.
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