Thermal conditioning apparatus

Details Thermal conditioning apparatus Thermal conditioning apparatus

1999-02-12

2000-04-18

Lund, Jeffrie R.

Coating apparatus

Gas or vapor deposition

Work support

118728, 118729, 118668, 118500, 269 21, 269292, 156345, 20429815, C23C 1600, C23C 1400, C23F 102

Patent

active

060510749

ABSTRACT:
A wafer support including a plate having a top surface and a lift element opening extending trough said plate. The support also includes a support member adjacent the top surface having a proximal end, a distal end and a bore from the proximal to the distal end and a vacuum source in communication with the bore. The support furthermore includes a lift element having a contacting end disposed through the lift element opening and a drive coupled to at least one of the plate and the lift element.

REFERENCES:
patent: 3460822 (1969-08-01), Link
patent: 4597569 (1986-07-01), Itamoto et al.
patent: 4640501 (1987-02-01), Poland
patent: 4671250 (1987-06-01), Hurley et al.
patent: 4684113 (1987-08-01), Douglas et al.
patent: 4693211 (1987-09-01), Ogami et al.
patent: 4838978 (1989-06-01), Sekine et al.
patent: 4869481 (1989-09-01), Yabu et al.
patent: 4870923 (1989-10-01), Sugimoto
patent: 4902531 (1990-02-01), Nakayama et al.
patent: 4955590 (1990-09-01), Narushima et al.
patent: 5199483 (1993-04-01), Bahng
patent: 5374829 (1994-12-01), Sakamoto et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5462603 (1995-10-01), Murakami
patent: 5484483 (1996-01-01), Kyogoku
patent: 5516367 (1996-05-01), Lei et al.
patent: 5534073 (1996-07-01), Kinoshita et al.
patent: 5564682 (1996-10-01), Tsuji
patent: 5569350 (1996-10-01), Osada et al.
patent: 5645646 (1997-07-01), Beinglass et al.
patent: 5660673 (1997-08-01), Miyoshi
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 5665167 (1997-09-01), Deguchi et al.
patent: 5669977 (1997-09-01), Shufflebotham et al.
patent: 5695568 (1997-12-01), Sinha et al.
patent: 5700725 (1997-12-01), Hower et al.
patent: 5707051 (1998-01-01), Tsuji
patent: 5730801 (1998-03-01), Tepman et al.
patent: 5735960 (1998-04-01), Sandhu et al.
patent: 5738165 (1998-04-01), Imai
patent: 5796066 (1998-08-01), Guyot
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5823736 (1998-10-01), Matsumura
patent: 5861601 (1999-01-01), Sato et al.
patent: 5885353 (1999-03-01), Strodtbeck et al.
patent: 5928427 (1999-07-01), Hwang

Affiliated with

Also associated with

Rating

Thermal conditioning apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal conditioning apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal conditioning apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2333542