4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Shahram Mostafazadeh

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Apparatus and method for force mounting semiconductor...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Apparatus and method for force mounting semiconductor...

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Apparatus and method of manufacturing a stackable package...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Ball grid array package with enhanced thermal and electrical cha

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Ball grid array package with lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-154092

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