Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-04-05
2005-04-05
Niebling, John F. (Department: 2812)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S313000
Reexamination Certificate
active
06875560
ABSTRACT:
A method of testing an integrated circuit is provided, which includes providing a semiconductor substrate having a semiconductor device provided thereon. A first dielectric layer is formed over the semiconductor substrate and a first channel is formed in the first dielectric layer in contact with the semiconductor device. A first contact pad mask layer is formed and a first contact pad in the first contact pad mask layer is formed in contact with the first channel. The first contact pad is used to test the first channel and the semiconductor device and the first contact pad mask layer and the first contact pad are removed.
REFERENCES:
patent: 5629137 (1997-05-01), Leedy
patent: 5654127 (1997-08-01), Leedy
Erhardt Jeffrey P.
Shetty Shivananda S.
Steffan Paul J.
Advanced Micro Devices , Inc.
Ishimaru Mikio
Niebling John F.
Stevenson Andre′ C.
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